Electronic components technology innovation policy favorable

【Abstracts】 The overall objective: to establish an overall coordination mechanism, increase capital input, play a guiding role in policy, improve the technical standards system, actively carry out international cooperation and increase personnel training. Focus on the development of basic semiconductor materials (electronic grade polysilicon, high-quality low-cost solar polysilicon, 8-12 inch silicon epitaxial wafers), high-end general-purpose chip technology, advanced packaging and measurement and testing technologies, new types of components (MEMS, LTCC) technology, and new types of displays Touch technology (TFT-LCD, PDP, OLED, electronic paper, 3D display, laser display, etc.), related electronic equipment, solar cells, lithium batteries, and high-efficiency high-brightness LED devices.

Subdivision industry: basic semiconductor materials, packaging and testing, touch technology, LED

Key figures: driving investment of about 500 billion yuan; industry sales totaled 1.88 trillion yuan; total output of electronic components exceeding 2.8 trillion; and meeting 70% of domestic market demand.

The plan proposes that during the 11th five-year period, “the enterprise has not truly become the main body of technological innovation”, there are three main problems: “The key technology of the industry is highly dependent on the outside world” and “the input of technology innovation is insufficient, especially the research input to the basic technology of the industry is seriously insufficient”. We believe that these three aspects will become the main breakthrough point for the technological innovation of the Twelve Five-Year Industry, that is, to realize the system that takes the enterprise as the protagonist of innovation, and focus on breakthroughs in core key technologies, especially basic technologies. Optimistic about touch technology, LED, MEMS technology, LTCC technology in the sub-industry. ——The policy of Minsheng Securities is positive. The "Development Plan" focuses on the development of the industry related to various sub-sectors: computer manufacturing, digital television, high-definition playback, new components, semiconductor integrated circuit manufacturing and advanced packaging technology, LED epitaxial and chip manufacturing technology, new display technologies, Key electronic equipment key technologies, advanced electronic materials technology, communication technology and sensor technology. The new plan proposes six safeguards such as establishing an overall coordination mechanism, increasing capital input, giving play to the role of policy guidance, improving the technical standards system, actively developing international cooperation, and intensifying personnel training, and providing Chinese companies with funds and talents. International exchange and other comprehensive support for technological innovation.